Wahyono, Agung and Tifania, A Z and Kurniawati, Elly and Kasutjianingati, Kasutjianingati and Kang, W W and Chung, S K (2018) Physical properties and cellular structure of bread enriched with pumpkin flour. IOP Conference Series : Erath and Enviromental Science, 208 (1). pp. 1-7. ISSN 2527-6220
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Abstract
Production of a variety of bread is driven by the consumer interest in bringing a unique and healthier bread to the table. This study was aimed to evaluate the effect of partial substitution of pumpkin flour on physical properties and cellular structure of pumpkin bread. Pumpkin breads were made by partially substituting wheat flour with 5% to 20% of pumpkin flour. The physical properties and cellular structures of breads were evaluated. Breads specific volume decreased significantly at 10% and at higher level of pumpkin flour enrichment. Pumpkin flour did not affect the texture of enriched bread compared to that of control breads. The lightness of crumb decreased significantly with 10% of pumpkin flour enrichment. Inversely, the redness and yellowness increased significantly at the level of enrichment of 5% and 10%, respectively. Pumpkin flour enrichment affected significantly the cellular structured of enriched breads except of cell density. Mean cell area of enriched breads was smaller than that of control breads. At the level of 20%, pumpkin flour enrichment increased significantly the cell area of enriched bread. We suggest the use of pumpkin flour less than 10% in manufacturing pumpkin enriched bread without compromising its physical properties. At higher level, the pumpkin flour enrichment can be done to improve the cellular structures of bread.
Item Type: | Article |
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Subjects: | 140 - Rumpun Ilmu Tanaman > 160 - Teknologi dalam Ilmu Tanaman > 163 - Teknologi Pertanian |
Divisions: | Jurusan Teknologi Pertanian > Prodi D4 Teknologi Rekayasa Pangan > Publikasi |
Depositing User: | elly kurniawati |
Date Deposited: | 18 Apr 2023 02:18 |
Last Modified: | 18 Apr 2023 02:18 |
URI: | https://sipora.polije.ac.id/id/eprint/22605 |
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